cystech electronics corp. spec. no. : c338sh issued date : 2010.06.09 revised date : 2013.09.10 page no. : 1/6 CSOD140SH cystek product specification sod-123 1.0amp. surface mount schottky barrier diodes CSOD140SH features ? for surface mounted applications. ? for use in low voltage, high frequency inverters, free wheeling, and polarity protection applications ? plastic material used carries underwriters laboratory flammability classification 94v-0 ? low leakage current ? high surge capability ? high temperature soldering: 250 c/10 seconds at terminals ? exceeds environmental standards of mil-s-19500/228 ? rohs compliant package mechanical data ? case: molded plastic, jedec sod-123. ? terminals: pure tin plated, solderable per mil-std-202 method 208 ? polarity: indicated by cathode band. ? weight: 0.04 gram approximately ordering information device package shipping CSOD140SH-0-t1-g sod-123 (pb-free lead plating an d halogen-free package) 3000 pcs / tape & reel environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t1 : 3000 pcs/ tape & reel in 7? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c338sh issued date : 2010.06.09 revised date : 2013.09.10 page no. : 2/6 CSOD140SH cystek product specification maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise specified.) parameter symbol limits units repetitive peak reverse voltage v rrm 40 v maximum rms voltage v rms 28 v maximum dc blocking voltage v r 40 v maximum instantaneous forward voltage, i f =1a (note 1) v f 0.55 v average forward rectified current i o 1 a peak forward surge current @8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 30 a maximum dc reverse current v r =40v,t j =25 (note 1) v r =40v,t j =125 (note 1) i r 0.3 10 ma ma power dissipation p d 500 mw maximum thermal resistance, junction to ambient r th,ja 250(typ) /w diode junction capacitance @ f=1mhz and applied 5v reverse voltage c d 45 (typ) pf storage temperature range tstg -65 ~ +175 operating temperature range t j -50 ~ +150 notes : 1.pulse test, pulse width=300 sec, 2% duty cycle typical characteristics fig. 1 forward current derating curve 0 0.2 0.4 0.6 0.8 1 1.2 0 25 50 75 100 125 150 175 200 case temperature---t c () average forward current---io(a) resistive or inductive load 0.375"(9.5mm) lead length fig. 2 maximum non-repetitive peak forward surge current 0 5 10 15 20 25 30 11 0 number of cycles at 60hz peak forward surge current---i fsm (a) 1 0 0
cystech electronics corp. spec. no. : c338sh issued date : 2010.06.09 revised date : 2013.09.10 page no. : 3/6 CSOD140SH cystek product specification typical characteristics(cont.) fig 3. forward characteristics 10 100 1000 10000 100000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 forward voltage---v f (v) instantaneous forward current---if(ma) pulse width=300s, 1% duty cycle fig. 4 typical reverse characteristics 0.1 1 10 100 1000 10000 0 102030405060 reverse voltage---v r (v) reverse leakage current---i r (a) tj=75 tj=25 tj=125 fig. 5 typical junction capacitance 10 100 1000 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz vsig=50mvp-p fig. 6 typical transient thermal impedance 0.1 1 10 100 0.01 0.1 1 10 100 pulse duration---t(s) transient thermal impedance(/w) recommended soldering footprint
cystech electronics corp. spec. no. : c338sh issued date : 2010.06.09 revised date : 2013.09.10 page no. : 4/6 CSOD140SH cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c338sh issued date : 2010.06.09 revised date : 2013.09.10 page no. : 5/6 CSOD140SH cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c338sh issued date : 2010.06.09 revised date : 2013.09.10 page no. : 6/6 CSOD140SH cystek product specification sod-123 dimension marking: sl 2-lead sod-123 plastic surface mounted package cystek package code: sh style: pin 1.cathode 2.anode inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.102 0.110 2.600 2.800 d 0.018 0.026 0.450 0.650 b 0.059 0.067 1.500 1.700 e 0.140 0.152 3.550 3.850 c 0.041 0.049 1.050 1.250 notes: 1.controlling dimension : millimeters. 2.lead thickness specified per l/f drawing with solder plating. 3.if there is any question with pa cking specification or packing me thod, please contact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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